We provided long-term architectural advisory and turn-key multi-disciplinary development for Medoc's next-generation neurological pain-stimulation and diagnostic equipment, engineering the platform under strict FDA medical device regulations.
For the innovative CHEPS product line, we engineered a deterministic, real-time embedded firmware layer utilizing a highly calibrated PID (Proportional-Integral-Derivative) control algorithm. This control loop dynamically governs electrical currents to drive skin-surface thermal thermodes to target diagnostic temperatures at maximum velocity, while mathematically preventing any thermal overshoot to guarantee patient safety and zero-fault execution.
Our technical delivery encompassed three tightly coupled engineering modules:
- Real-Time Embedded Firmware: Programmed directly onto hardware microcontrollers utilizing the 8051 Keil C compiler.
- End-to-End Serial Communication Protocol: A custom full-duplex communication interface linking the embedded firmware layer with a PC command station, developed in .NET C# on the host station and 8051 Keil C on the firmware device side.
- Internal Decoupled Subsystem Interface: A clean abstraction layer on the PC host built in C#, safely connecting our end-to-end communication pipeline with the external third-party operator user interface.
Proving our extreme development efficiency, the entire system was engineered from scratch to full functional verification in a record timeline of just 3.5 months. The first production unit was successfully delivered and validated by leading R&D pharmaceutical research scientists at global giants including Eli Lilly and Pfizer.